材料科学
无定形固体
硅
聚乙烯
声子
分子动力学
界面热阻
热导率
非晶硅
热的
复合材料
凝聚态物理
热阻
化学物理
热力学
晶体硅
结晶学
化学
计算化学
物理
冶金
作者
Ming Hu,Sergei Shenogin,Pawel Keblinski
摘要
Using nonequilibrium molecular dynamics simulations, we study the interfacial thermal conductance between single crystal silicon and amorphous polyethylene (PE). We estimate that the silicon-PE interfacial thermal conductance is about 20MW∕m2K at room temperature, which is equivalent to the resistance of 16nm thick layer of bulk amorphous polyethylene. We also study the role of solid stiffness and the bonding strength across the interface on the interfacial thermal resistance. With strong interfacial bonding, our results are in agreement with the diffuse mismatch model and phonon radiation limit predictions, suggesting that in this case, heat carrying acoustic phonons in solids have transmission coefficients to polymer equal almost to unity.
科研通智能强力驱动
Strongly Powered by AbleSci AI