Boron Nitride‐Polymer Composites with High Thermal Conductivity: Preparation, Functionalization Strategy and Innovative Structural Regulation

Abstract The escalating thermal challenges posed by increasing power densities in electronic devices emerge as a critical barrier to maintain their sustained and reliable operation. Addressing this issue requires the strategic development of materials with superior thermal conductivity properties to facilitate progress in high‐power electronics development. Thermal conductive polymer composites by incorporating ceramic material renowned for their exceptional thermal conductivity adjustability, insulating properties, and moldability, are emerging as a promising solution to this urgent challenge. Hexagonal boron nitride (h‐BN) nanomaterials emerge as highly promising candidates for thermal management applications, owing to their exceptional mechanical properties, superior thermal stability, remarkable thermal conductivity coefficients, minimal thermal expansion characteristics, and outstanding chemical inertness. In this work, the progress of ≈10 years on high thermal conductive boron nitride‐filled polymer composites is thoroughly summarized. Moreover, strategies for h‐BN and other boron nitride nanomaterials‐filled polymer composites at synthesis, functionalization, and innovative structural design are discussed in detail. The main challenges and future development of boron nitride‐polymer composites in thermal management are also proposed, which will provide meaningful guidance for the design and practical applications of thermal management materials.