分层(地质)
材料科学
泄漏(经济)
涂层
复合材料
俯冲
构造学
生物
宏观经济学
古生物学
经济
作者
Zhiwen Li,Ou Dong,Juanjuan Huang,Junrui Peng
标识
DOI:10.1109/icsj59341.2023.10339583
摘要
High Tg EMC is more robust in HTRB Test for power package but exhibits high delamination in MSL Test. Polyimide (PI) coating shows significant improvement on high Tg EMC delamination in MSL.
科研通智能强力驱动
Strongly Powered by AbleSci AI