材料科学
碳纳米管
石墨烯
导电体
填料(材料)
热传导
热阻
数码产品
热的
复合材料
热导率
聚合物
碳纤维
纳米技术
复合数
气象学
化学
物理化学
物理
作者
Yinhang Zhang,Young‐Jung Heo,Yeong‐Rae Son,Insik In,Kay-Hyeok An,Byung-Joo Kim,Soo‐Jin Park
出处
期刊:Carbon
[Elsevier BV]
日期:2018-10-24
卷期号:142: 445-460
被引量:339
标识
DOI:10.1016/j.carbon.2018.10.077
摘要
Rapid developments of integrated circuits in electronics, aerospace, and aeronautics are always accompanied with the issue of heat diffusion, which impacts service efficiency and instrument life. Considering the weight, corrosion resistance, processing, and cost, carbon-based polymer composites are the most promising candidates for conductive materials; they have been widely investigated during the past few decades. The foremost objective of this article is to introduce the thermal conduction mechanism in the bulk polymer, crystalline particles, and carbon-based polymer composites, and review recent studies of carbon nanotube- or graphene-based interfacial thermal materials. The relative results and progress are summarized, and some thermal conductive parameters, such as filler structure, filler orientation, filler dispersion, and interfacial thermal resistance are comprehensively reviewed. An outlook of the future challenges of the thermal conductive materials is proposed at the end. This article provides highly accessible and comprehensive thermal conductive knowledge to researchers who are working on thermal conduction area.
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