接头(建筑物)
电阻率和电导率
导电体
抓住
材料科学
一致性(知识库)
过程(计算)
实验数据
指数函数
计算机科学
能量(信号处理)
经验模型
电子线路
数学模型
机械
过程控制
实验设计
复合材料
超导电性
等效电路
数据一致性
数据建模
电网
作者
Shinya SERA,Takanobu Kiss,Zeyu Wu,Kenji SUZUKI,Kohei Higashikawa
标识
DOI:10.1109/tasc.2026.3665175
摘要
A data-efficient analytical approach was developed to quantitatively predict and control the joint resistivity in sonic-welded REBCO coated conductors. By employing the proposed Acoustic Energy Activation Bonding (AEAB) model, which describes an exponential dependence of bonding probability on the input acoustic energy, the AEAB model successfully reproduced the experimental data within approximately ±22% relative deviation. Even when only five distinct process conditions were used, the model achieved reasonably accurate prediction of joint resistivity (12.1 ± 2.1 nΩcm2) and identified optimal conditions realizing 9.8 nΩcm2 without degradation. This suggests that, unlike conventional empirical methods requiring extensive trials, the present approach provides a data-efficient framework for controlling joint resistivity from a limited dataset. The model was further applied to MOCVD-processed tapes, confirming its consistency and general applicability across different types.
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