高电子迁移率晶体管
击穿电压
兴奋剂
材料科学
光电子学
支柱
拓扑(电路)
电气工程
晶体管
电压
物理
工程类
结构工程
作者
Miao Zhang,Zhiyou Guo,Yong Huang,Yuan Li,Jiancheng Ma,Xiaoyu Xia,Xiuyang Tan,Fan Xia,Huiqing Sun
出处
期刊:IEEE Access
[Institute of Electrical and Electronics Engineers]
日期:2021-01-01
卷期号:9: 9895-9902
被引量:29
标识
DOI:10.1109/access.2021.3049374
摘要
A GaN-based vertical superjunction high electron mobility transistor (SJ HEMT) with a composite structure (CS-SJ HEMT) is proposed and analyzed by Silvaco TCAD to improve the breakdown voltage and specific on-resistance (RonA). In this paper, CS-SJ HEMT is compared with SJ HEMT with traditional structure (TS-SJ HEMT), SJ HEMT with only particular doping pillars (DP-SJ HEMT) and SJ HEMT with only special P-gate (SP-SJ HEMT). The particular doping pillars mean the doping concentration of n-pillar increases with a gradient from top to bottom, and the concentration of p-pillar is the same as the middle of n-pillar, which reduces the RonAby only 4%. The special P-GaN cap layer can reduce the RonAby 10%, and it can even increase the on-state current in the saturation region. The CS-SJ HEMT combines both doping pillars and special P-gate structures, and the RonAcan be reduced by 14%. By the optimized design, the RonAcan be reduced by 30% with BV = 2580 V, or the RonAcan be reduced by 21% with BV = 2720 V. These results show that the composite structure of SJ HEMT contributes to improving the BV and RonAand propose a useful approach for improving the vertical HEMTs.
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