3D打印
瓶颈
组分(热力学)
软质材料
钥匙(锁)
计算机科学
制造工程
可穿戴计算机
工程类
可穿戴技术
纳米技术
电子元件
3d打印
数码印刷
机械工程
三维打印
材料科学
工程制图
挤压
作者
Suyun Li,Zengqin Shi,Yixuan Wang,Wenqing Wang,Rujie He
出处
期刊:Materials
[Multidisciplinary Digital Publishing Institute]
日期:2025-12-02
卷期号:18 (23): 5428-5428
被引量:4
摘要
Due to their unique functional properties, such as deformability, bendability, stretchability, and even biocompatibility, sensing, or actuation, flexible materials have become an indispensable and crucial component in electronic systems such as wearable electronic devices and soft robots. Facing the complex demands of various application scenarios, 3D printing technology can be utilized to customize the preparation of various flexible materials into desired shapes. However, compared to rigid materials, flexible materials still face printing issues such as pore defects and weak interlayer bonding during the 3D printing process. Therefore, this paper focuses on analyzing the key bottleneck issues and technical challenges currently existing in flexible material 3D printing technology, and provides an overview of the progress in preparing flexible materials using 3D printing technologies, such as Material Extrusion and Vat Polymerization. Finally, it looks forward to the technical challenges and future development of 3D printing with flexible materials.
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