Non-covalent surface functionalization of nanofillers towards the enhancement of thermal conductivity of polymer nanocomposites: A mini review

Thermal management plays a significant role in determining the performance, stability, and lifespan of electronic devices. Over the past decade, the development of polymeric nanocomposites with high thermal conductivity are garnering attention due to their potential use in thermal management schemes for various electronic applications. Nanofillers incorporated polymer-based thermal interface materials are extensively studied due to their ease of processability, flexibility in design, and many other properties. Effective dispersion of nanofillers and interfacial adhesion between the nanofillers and the polymer matrix are the key factors in the formation of thermal conduction pathway throughout the polymer matrix, thus influencing the thermal conductivity. To achieve these, both covalent and non-covalent surface functionalization techniques are employed and recently, non-covalent surface functionalization techniques are getting more attention over the other. This review outlines the need for surface functionalization on the fillers for their use to prepare polymer composites in thermal management system and discusses various types of non-covalent surface functionalization of fillers towards enhancement of thermal conductivity of polymer composites.