Recent Advances and Trends in Cu–Cu Hybrid Bonding
纳米技术
材料科学
计算机科学
工程物理
工程类
作者
John H. Lau
出处
期刊：IEEE Transactions on Components, Packaging and Manufacturing Technology [Institute of Electrical and Electronics Engineers] 日期：2023-03-01卷期号：13 (3): 399-425被引量：105
标识
DOI：10.1109/tcpmt.2023.3265529
摘要
In this study, the recent advances and trends in Cu–Cu hybrid bonding will be investigated. Emphasis is placed on the definition, kinds, advantages and disadvantages, challenges (opportunities), and examples of Cu–Cu bumpless hybrid bonding. Also, some recommendations will be provided.
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(2025-6-4)
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