Recent Developments in Thermal Management of 3D ICs: A Review

Three-dimensional integration circuits (3D ICs) have become an important direction of integrated circuits, which brings in a higher integration level, higher power density, and shorter wire length. However, the heat management challenge becomes one of the key limitations for the development of 3D integration which needs desperate solutions. To address this challenge, the researchers conducted an in-depth investigation into heat transfer technologies within key structures of 3D ICs. This paper aims to review the literature on thermal management technologies, with a particular emphasis on advancements in three critical areas: thermal interface materials (TIM), through-silicon vias (TSV), and heat sink designs. Continuous research and innovation in TIM, TSV, and heat sink structures have provided diverse approaches and technical solutions for addressing thermal management issues in 3D ICs. It is expected that this review article can help researchers in academia and industry to understand the state-of-the-art of heat transfer in 3D ICs and provide better research ideas.