选择性
各向同性腐蚀
盐酸
柠檬酸
化学
酒石酸
蚀刻(微加工)
基质(水族馆)
铝
化学工程
材料科学
纳米技术
无机化学
催化作用
有机化学
图层(电子)
海洋学
地质学
工程类
作者
O. Dier,Chun Lin,Markus Grau,Markus‐Christian Amann
标识
DOI:10.1088/0268-1242/19/11/006
摘要
A series of wet-chemical etchants for materials lattice-matched to GaSb was investigated. The etch rates for GaSb, AlAsSb, InAsSb and InAs with etch solutions based on KNa–tartaric acid (C4H4KNaO6), citric acid (C6H8O7) and hydrochloric acid were determined and the selectivities for the four different etching solutions are shown. The applicability of the selectivity between GaSb and InAs (respectively InAsSb) with C4H4KNaO6:HCl: H2O2:H2O (selectivity higher than 15:1) and C6H8O7:H2O2 (selectivity around 1:100) is proved by a substrate removal experiment. Also a new etchant for AlAsSb is proposed: HCl:H2O2:H2O etches AlAsSb versus GaSb with a selectivity of 5:1 and the GaSb surface underneath is smooth and without any remaining particles of oxidized aluminium.
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