2D Single‐Crystalline Copper Nanoplates as a Conductive Filler for Electronic Ink Applications

Abstract Large‐scale 2D single‐crystalline copper nanoplates (Cu NPLs) are synthesized by a simple hydrothermal method. The combination of a mild reductant, stabilizer, and shape modifier allows the dimensional control of the Cu nanocrystals from 1D nanowires (NWs) to 2D nanoplates. High‐resolution transmission electron microscopy (HR‐TEM) reveals that the prepared Cu NPLs have a single‐crystalline structure. From the X‐ray photoelectron spectroscopy (XPS) analysis, it is found that iodine plays an important role in the modification of the copper nanocrystals through the formation of an adlayer on the basal plane of the nanoplates. Cu NPLs with an average edge length of 10 μm are successfully synthesized, and these Cu NPLs are the largest copper 2D crystals synthesized by a solution‐based process so far. The application of the metallic 2D crystals as a semitransparent electrode proves their feasibility as a conductive filler, exhibiting very low sheet resistance (0.4 Ω ▫ −1 ) compared to Cu NWs and a transmittance near 75%. The efficient charge transport is due to the increased contact area between each Cu NPL, i.e., so‐called plane contact (2D electrical contact). In addition, this type of contact enhances the current‐carrying capability of the Cu NPL electrodes, implying that the large‐size Cu NPLs are promising conductive fillers for printable electrode applications.