The Development of Micro-electronics Packaging Technology and Microminiaturization of Electronic Equipment
作者
HU Xian-jin
摘要
The microminiaturization of electronic equipments incarnate on short, small, light for its size, thickness and the weight. Also incarnate on its high-performance, multifunction, high-reliability and portability. One key to achieve the above performances is the advanced micro-electronics packaging technology applied on the various electronic equipments. And the electronic equipments combined with the advanced micro-electronics packaging technology will accelerate the development of the microminiaturization. This article is expatiating the way to the higher-stage development of the micro-electronics packaging technology and the microminiaturization of electronic equipments.