Surface modification and adhesive-free adhesion of polytetrafluoroethylene (PTFE) and silicone gel containing oleophilic SiO2 powder by plasma treatment

Polytetrafluoroethylene (PTFE) has high-frequency characteristics and low transmission loss, and is expected to be used as a substrate material of printed wiring board for high-frequency applications. Meanwhile, silicone gel has superior properties such as attaching/detaching, weather resistance, and human safety. If the PTFE and silicone gel can be strongly adhered to, they can be applied to internet of things (IoT) devices that can be attached and detached freely. However, adhesion between PTFE, which has poor adhesion, and silicone gel, which has low mechanical strength, is difficult and has not been reported. In this study, PTFE was modified with heat-assisted plasma treatment, and silicone gel was treated with oleophilic SiO