Effect of wire composition on microstructure and properties of wire and arc additive manufactured ZAlCu5MnCdVA aluminum alloy

Purpose Wire and arc additive manufacturing (WAAM) technology-based cold metal transfer (CMT) to produce large aluminum alloy parts has become more and more popular. In WAAM, wire is the only raw material. The purpose of this paper is to study the effect of wire composition on the microstructure and properties of the ZAlCu5MnCdVA alloy deposited by WAAM. Design/methodology/approach Two thin-walled ZAlCu5MnCdVA alloys with different wire compositions were prepared by WAAM. The copper contents were 4.7% (Al-4.7Cu) and 5.0% (Al-5.0Cu), respectively. The microstructure, element distribution and evolution of precipitated phases of the two samples were characterized and analyzed by optical microscopy, scanning electron microscopy and transmission electron microscopy. Hardness and tensile properties of samples were tested, and strengthening mechanism was analyzed in detail. Findings The results show that grain sizes of Al-4.7Cu and Al-5.0Cu are less than 40 μm. The average mass fraction of Cu in Al matrix and the number of nanometer scale θ'' and θ' phases are the main factors affecting the tensile properties of Al-Cu alloy. Tensile properties of two materials show different characteristics at room temperature and high temperature. Al-5.0Cu is better at room temperature and Al-4.7Cu is better at high temperature. The yield strength (YS), ultimate tensile strength (UTS) and elongation in the x direction of Al-5.0Cu at room temperature are 451 ± 10.2 MPa, 486 ± 10.2 MPa and 9 ± 0.5%, respectively. The YS, UTS and elongation in the x direction of Al-4.7Cu at high temperature are 290 ± 4.5 MPa, 356 ± 7.0 MPa and 13% ± 0.2%, respectively. Originality/value Experiments show that the increase of Cu element can improve the properties at room temperature of the ZAlCu5MnCdVA alloy by WAAM, but its properties at high temperature decrease.