材料科学
焦耳加热
氮化镓
光电子学
范德瓦尔斯力
热导率
工程物理
基质(水族馆)
热的
接口(物质)
纳米技术
图层(电子)
热力学
复合材料
化学
物理
海洋学
有机化学
毛细管数
分子
地质学
毛细管作用
作者
Wang Quan-jie,Deng Yuge,Xiangjun Wang
出处
期刊:Chinese Physics
[Acta Physica Sinica, Chinese Physical Society and Institute of Physics, Chinese Academy of Sciences]
日期:2023-01-01
卷期号:72 (22): 226301-226301
标识
DOI:10.7498/aps.72.20230791
摘要
Gallium nitride (GaN) has great potential applications in the field of high-frequency and high-power electronic devices because of its excellent material properties such as wide band gap, high electron mobility, high breakdown field strength. However, the high power GaN electronic device also exhibits significant self-heating effects in operation, such as a large amount of Joule heat localized in the thermal channel, and heat dissipation has become a bottleneck in its applications. The interface thermal conductance (ITC) between GaN and its substrate is the key to determining the thermal dissipation. In this work the various GaN interface defects and their effects on ITC are first discussed, and then some methods of studying interface thermal transport are introduced, including theoretical analysis and experimental measurements. Then, some GaN ITC optimization strategies developed in recent years are introduced through comparing the specific cases. In addition to the common chemical bond interface, the weak coupling interface by van der Waals bond is also discussed. Finally, a summary for this review is presented. We hope that this review can provide valuable reference for actually designing GaN devices.
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