沟槽
浅沟隔离
材料科学
光电子学
电气工程
工程类
纳米技术
图层(电子)
作者
Yuan Wang,Yuming Zhang,Xun Zhang,Yanlin Zhang,Te Xiong,Rongjie Yin,Hao Wu,Jie Jiang,Shengdong Hu
出处
期刊:2019 International Conference on Electrical, Communication, and Computer Engineering (ICECCE)
日期:2023-12-30
卷期号:: 1-5
标识
DOI:10.1109/icecce61019.2023.10442164
摘要
In this paper, we present a comparative study on the effects of Total Ionizing Dose (TID) radiation on the Split-Gate Trench VDMOS (SGT-MOS) and the conventional Trench VDMOS (T-MOS), both with equal rated breakdown voltages of 100 V, using experimental methods. The experimental findings reveal that the same degradation trends in the threshold voltage (V th ) were found for both types of devices. However, the breakdown voltage (BV) of SGT-MOS exhibits greater sensitivity to TID radiation compared to the T-MOS. Utilizing Sentaurus TCAD, we analyze and discuss the variances in BV shifting behavior between the SGT-MOS and T-MOS. The differences in BV shifting behavior between SGT-MOS and T-MOS can be attributed to the positive oxide trapped charges induced by TID, which could significantly affect the electric field distribution for SGT-MOS, but not for T-MOS. To address this issue, three methods are proposed to enhance the TID tolerance for the SGT-MOS and T-MOS. These methods include avoiding high-temperature processes, reducing the thickness of the oxide layer, and decreasing the doping in the drift layer.
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