芯(光纤)
材料科学
纤维
联轴节(管道)
硬包层石英光纤
全硅纤维
光子晶体光纤
反射(计算机编程)
熔接
光纤
包塑石英纤维
光学
塑料光纤
光电子学
复合材料
物理
光纤传感器
计算机科学
程序设计语言
作者
Bo Shi,Cong Zhang,Thomas W. Kelly,Xuhao Wei,Meng Ding,Meng Huang,Songnian Fu,Francesco Poletti,Radan Slavı́k
出处
期刊:ACS Photonics
[American Chemical Society]
日期:2024-07-29
卷期号:11 (8): 3288-3295
被引量:1
标识
DOI:10.1021/acsphotonics.4c00677
摘要
A main, yet-unsolved challenge in splicing hollow-core fiber (HCF) into standard single-mode fiber (SMF) systems lies in managing the strong Fresnel back-reflection that occurs when the light travels from the empty core of the HCF into the glass core of the SMF or vice versa. This impacts the performance of fiber systems that combine SMFs and HCFs due to effects such as multipath interference. Here, we demonstrate a new technique that combines angle-cleaving the HCF, which reduces the back-reflection, with offset-splicing the mode-field adapter to the SMF, which compensates for the refraction at the glass–air interface, enabling us to achieve low coupling loss. We first analyze this novel configuration via simulations and show that it is possible to achieve a coupling loss that is comparable to a conventional flat-cleaved splice. Subsequently, we fabricate an SMF–HCF connection with a loss of 0.6 dB prior to arcing (1.2 dB after splicing) and ultralow back-reflection (−64 dB) by applying an optimized 4.5° angle and 5 μm offset. To the best of our knowledge, this is the first low-insertion-loss spliced SMF–HCF connection where a widely acceptable level of back-reflection of <−60 dB is achieved.
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