互调
非线性系统
材料科学
微波食品加热
有限元法
电子工程
接触力学
等效电路
电接点
压力(语言学)
接触电阻
工程类
结构工程
电气工程
光电子学
复合材料
物理
电压
电信
哲学
量子力学
CMOS芯片
语言学
放大器
图层(电子)
作者
Kai Zhang,Tuanjie Li,Jie Jiang
标识
DOI:10.1109/temc.2017.2725278
摘要
For the passive intermodulation (PIM) problem of nonlinear contact on microwave connectors, an effective method is presented to improve the computational accuracy of PIM. First of all, the contact stress distribution on contact surface is analyzed by finite-element method based on the Weierstrass-Mandelbrot model. The contact stress and real area of contact are evaluated under different loading conditions. Then, the electrical parameters of physical effects of nonlinear contact are derived based on the electric contact theory and the physical effects of metal-metal microcontact. Finally, the nonlinear I-V relation is established from the microcontact equivalent circuit, and the third-order PIM power level generated by contact nonlinearity is revealed in analytic form. The analytic results are verified by the PIM test experiments. This work provides a novel way for PIM calculation of rough surface contact.
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