Nondestructive inspection of packaged microcircuits by aperture-type terahertz near-field imaging

Abstract A scanning aperture-type terahertz near-field imaging system is developed to perform precise nondestructive testing on packaged aluminum etched antenna arrays, and surface imaging of a flexible gold electrode array, to obtain subsurface imaging and surface imaging. The resolution of subsurface imaging is 110 and 500 μ m when the packaging (polyethylene terephthalate) thickness is 50 and 200 μ m respectively, and the surface imaging resolution is 6 μ m at 0.11 THz. An adaptive threshold segmentation algorithm of Hilbert scan combined with wavelet transform were employed to successfully suppress the noise of the imaging results due to the change of near-field distance. We also proposed a derivative filtering extremum threshold segmentation algorithm to effectively suppress severely uneven threshold distribution of the packaged aluminum etched antenna arrays.