Fabrication of lead-free frit and Si-based silver conductive paste

To understand the effect of amounts of lead-free frits components on its property,amounts of lead-free frits components were selected by the orthogonal experiment method.A kind of lead-free frit which composed of w(Bi2O3)62.7%,w(B2O3)18.8%,w(ZnO)1.5%,w(A)6.0%,w(D)8.0% was fabricated,its flow ability is 32.80 mm and transition temperature is 446 ℃.The silver conducting paste composed with the frit,silver powder and ethyl cellulose terpineol was prepared,then sintered on polysilicon chip at 720 ℃.The results show that the sintered Ag films appear bright and flat,its square resistivity and binder force with a thickness of(15±3) μm are 4.2×10–3 Ω/mm2 and 4 N,respectively.It can meet the requirement of Si-based electronic devices.