材料科学
电磁干扰
电磁屏蔽
电磁干扰
复合材料
复合数
聚苯胺
可穿戴计算机
光电子学
热导率
导电体
热的
消散
可穿戴技术
纳米复合材料
保温
数码产品
粘附
信号(编程语言)
纳米颗粒
电磁场
电磁辐射
声学
电压
工作(物理)
屏蔽效应
作者
Zhi Lei,Maoxia Lu,Daohai Zhang,Dongju Liu,Yupeng Hu,Anmin Song,Junlei Wang,Wei Gong
出处
期刊:Soft science
[OAE Publishing Inc.]
日期:2026-05-20
卷期号:6 (2)
摘要
With the rapid escalation of electromagnetic pollution and electromagnetic interference, conventional EMI shielding materials can no longer satisfy the integrated requirements of next-generation flexible electronic devices and information terminals for mechanical deformability, wearable adaptability, and real-time signal monitoring. In this work, a multifunctional polyacrylamide/glycerol (PG)/P@CoFe (PAM/Gly/PANI@CoFe<sub>2</sub>O<sub>4</sub>) composite organohydrogel sensor with synergistic electromagnetic dissipation was fabricated through a hydrothermal-assisted one-pot strategy. CoFe<sub>2</sub>O<sub>4</sub> magnetic nanoparticles were first synthesized via an ethylene glycol-assisted solvothermal route. Subsequently, the surface-active sites of CoFe<sub>2</sub>O<sub>4</sub> were utilized to induce aniline polymerization, yielding conductive-magnetic polyaniline (PANI)@CoFe<sub>2</sub>O<sub>4</sub> composite nanoparticles. Mechanical characterization demonstrated that the resulting organohydrogel exhibited excellent compressive properties, while the incorporation of glycerol effectively suppressed water evaporation and enhanced water-retention capability. Electromagnetic measurements revealed that, at a PANI@CoFe<sub>2</sub>O<sub>4</sub> loading of 4 wt.%, the 4 mm-thick hydrogel achieved an electrical conductivity of 0.55 ± 0.01 S/m and an average electromagnetic interference shielding effectiveness (EMI SE) of 50.27 ± 2.51 dB in the X-band. In addition, the hydrogel exhibited excellent thermal iInsulation performance. More importantly, its outstanding adhesion and rapid stimuli-responsive behavior enabled favorable human–machine interactive strain-sensing performance with good compatibility. This work provides an effective strategy for the development of integrated, robust multifunctional materials that simultaneously combine flexible sensing, electromagnetic shielding, and thermal insulation.
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