锡
等离子体增强化学气相沉积
电容器
材料科学
电极
堆栈(抽象数据类型)
电容
化学气相沉积
德拉姆
光电子学
电子工程
电气工程
冶金
化学
电压
计算机科学
程序设计语言
物理化学
工程类
作者
B.-L. Park,M.-B. Lee,Kyoung-Jun Moon,H.-D. Lee,Hyeonmuk Kang,M.-Y. Lee
标识
DOI:10.1109/iitc.1998.704761
摘要
The electrical characteristics of PECVD-WN/sub x/ and CVD-TiN films as the upper electrode for Ta/sub 2/O/sub 5/ capacitors were compared in a 3D stack structure. In terms of step coverage, CVD-TiN shows excellent results of about 90% at the stack structure corner, but PECVD-WN/sub x/ only reaches about 50%. However, WN/sub x/ electrodes at even 100 /spl Aring/-thickness exhibit equivalent capacitance and leakage current when compared with 150 /spl Aring/-thick CVD-TiN electrodes. It is demonstrated that both PECVD-WN/sub x/ and CVD-TiN are good candidates for the upper electrodes of Ta/sub 2/O/sub 5/ capacitors for ULSI DRAMs.
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