Flexible Encapsulation: Flexible Lamination Encapsulation (Adv. Mater. 29/2015)

A novel flexible-encapsulation method (Flex Lami-capsulation), which laminates a simple metal foil/rubbery polymer bilayer on flexible devices, is reported on page 4308 by T.-W. Lee and co-workers. Flex Lami-capsulation can be applied to the roll-to-roll process for mass production of flexible electronic devices, and overcomes the drawbacks of conventional rigid glass and thin-film encapsulation methods.