X-ray digital microlaminography for BGA and flip-chip inspection

X-ray laminography allows getting local depth information from big flat objects like PCBs and electronic assemblies, which cannot be reconstructed by tomographical approach. According to the needs in high-resolution inspection for electronic and micromechanic industries an X-ray microlaminography system has been developed. This instrument based on a new approach for the x-ray geometry with a minimum of moving parts and a digital extraction of depth information about all layers during one object turn.