材料科学
数字光处理
介观物理学
耗散系统
弹性体
3D打印
消散
复合材料
机械能
微电子机械系统
纳米技术
光电子学
光学
功率(物理)
物理
投影机
量子力学
热力学
作者
Nicholas A. Traugutt,Devesh Mistry,Chaoqian Luo,Kai Yu,Qi Ge,Christopher M. Yakacki
标识
DOI:10.1002/adma.202000797
摘要
Abstract Digital Light Processing (DLP) 3D printing enables the creation of hierarchical complex structures with specific micro‐ and macroscopic architectures that are impossible to achieve through traditional manufacturing methods. Here, this hierarchy is extended to the mesoscopic length scale for optimized devices that dissipate mechanical energy. A photocurable, thus DLP‐printable main‐chain liquid crystal elastomer (LCE) resin is reported and used to print a variety of complex, high‐resolution energy‐dissipative devices. Using compressive mechanical testing, the stress–strain responses of 3D‐printed LCE lattice structures are shown to have 12 times greater rate‐dependence and up to 27 times greater strain–energy dissipation compared to those printed from a commercially available photocurable elastomer resin. The reported behaviors of these structures provide further insight into the much‐overlooked energy‐dissipation properties of LCEs and can inspire the development of high‐energy‐absorbing device applications.
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