Stduy on removal method of Si residue caused by ALSI or ALSICU etch in semiconductor manufacturing

ALSI or ALSICU may be used as metal connecting line in semiconductor manufacturing. About 0.5%~1% Si is put in ALSI or ALSICU to prevent ALSI penetration into P-N junction to produce junction spiking. In order to remove the Si residues on wafer's surface,the mechanisms and relative merits of Si residues removal methods used in semiconductor manufacturing industry at present are compared and analyzed,and a new Si residue dry removal method is proposed in this paper. The standardized Si residue removal process was laid down. The standard procedure presented in this paper for removing the Si residue has an extensive guiding function in semiconductor manufacturing industry.