An Analysis on Thermal Resistance of Assembly Structures for Hybrid IC's

Based on the basic theory of thermal design for conventional electronic products,and combined with practical applications,a simple method for analyzing thermal resistance of typical assembly structures for hybrid(IC's) is described.Curves of internal thermal resistance of different typical structures vs.heating chip areas and external resistance vs.package surface areas are plotted.A method to analyze junction temperature of the chip using thermal resistance curves of the typical structure is presented,and solutions to associated problems are proposed.