First measurements of true charge transfer TDI (Time Delay Integration) using a standard CMOS technology

This work focus on an innovative noiseless charge transfer TDI pixel fabricated with a one poly standard Imaging CMOS technology. Parallel column charge to voltage conversion decreases drastically the number of needed charge transfers while keeping high motion/dynamic MTF (multi phase approach), high QE (photodiode based architecture) and low noise (no noise summation).