LiNbO/sub 3/ chip assembly on silica-based waveguide on terraced silicon substrate

To achieve an optical hybrid integration, an optical integration platform that functions as a waveguide and also as an optical bench for device assembly must be developed. However, in the conventional waveguide structure, the thick waveguide layers formed on the substrate prevent the silicon from performing the optical bench function. To overcome this difficulty, we have proposed a silica-based waveguide on terraced silicon (STS) as the optical integration platform. This paper describes the successful application of the STS-platform to a LiNbO/sub 3/ (LN) chip hybrid integration.>