过程(计算)
薄膜
材料科学
沉积(地质)
纳米技术
等离子体
计算机科学
工艺工程
工程物理
工程类
物理
操作系统
地质学
沉积物
量子力学
古生物学
作者
E. Muehlberger,Patrick R. Meyer
出处
期刊:Thermal spray
日期:2009-05-04
卷期号:83690: 737-740
被引量:4
标识
DOI:10.31399/asm.cp.itsc2009p0737
摘要
Abstract This paper discusses the history of the low-pressure plasma spraying (LPPS) process and some of the developments that led to its use as a thin film deposition technique. It also discusses the advantages of the process and its potential for further improvement and additional applications.
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