Exploring processing methods and interface features to enhance thermal conductivity in copper/diamond composites: a comprehensive review

Recent advances in copper/diamond composites have demonstrated thermal conductivities approaching 900 W/(m·K) and enhanced interfacial bonding through optimised processing and interface engineering. Our integrated review reveals that by fine-tuning sintering conditions and incorporating carbide-forming elements, the interfacial thermal resistance can be reduced by approximately 20%, resulting in a 15% overall improvement in composite thermal performance. This study presents a novel, integrated review that not only summarises state-of-the-art processing methods and interface modification strategies but also systematically correlates experimental findings with advanced theoretical modelling. By identifying key processing parameters and elucidating the crucial role of interface thermal resistance, it reveals new insights into the mechanisms that govern heat transfer in these composites. This comprehensive approach addresses major limitations such as high production costs and unreliable thermal performance, thereby paving the way for the development of next-generation thermal management materials with enhanced efficiency and reliability.