Wafer level system packaging and integration for solid state lighting (SSL)

In this paper, wafer level system packaging and integration for solid state lighting (SSL) is presented, which includes wafer level phosphor coating, wafer level LED chip encapsulation, wafer level optics manufacturing, reconfiguration (or reconstitution) of LED/silicon wafers, through silicon vias (TSV) formations between LED and silicon/ceramics/polymer wafers, wafer-to-wafer or wafer-to-chip bonding and stacking, and wafer level bumping technologies. A variety of wafer level bumping technologies is introduced, such as ball on I/O (BON), ball on polymer (BOP), redistribution dielectric layer (RDL) process, and copper post bumping process. The reliability improvement among different bumping technologies and the implications in SSL systems are discussed.