A review of substrate coupling issues and modeling strategies
作者
Raminderpal Singh
标识
DOI:10.1109/cicc.1999.777329
摘要
This tutorial paper reviews the technologies behind substrate coupling and modeling. The key focuses throughout are the importance of suitable substrate models and a sufficient understanding of the substrate coupling in the circuit being designed. Discussions include Radio Frequency (RF) and Mixed-Signal (MS) designs, but also touch upon System-on-Chip (SoC). An example RF circuit is simulated with a substrate model and the effect of substrate process variations on the circuit's performance is discussed.