范德瓦尔斯力
热电效应
材料科学
塞贝克系数
密度泛函理论
凝聚态物理
电子能带结构
极限抗拉强度
带隙
拓扑绝缘体
热电材料
电子结构
局部密度近似
玻尔兹曼常数
薄膜
从头算量子化学方法
抗压强度
态密度
直接和间接带隙
作者
Luo Xin,Sullivan, Michael B.,Quek Su Ying
出处
期刊:Cornell University - arXiv
日期:2013-08-07
标识
DOI:10.48550/arxiv.1308.1523
摘要
Bi2Se3 and Bi2Te3 are layered compounds of technological importance, being excellent thermoelectric materials as well as topological insulators. We report density functional theory calculations of the atomic, electronic and thermoelectric properties of strained bulk and thin film Bi2Se3 and Bi2Te3, focusing on an appropriate description of van der Waals interactions. The calculations show that the van der Waals Density functional with Cooper's exchange can reproduce closely the experimental interlayer distances in unstrained Bi2Se3 and Bi2Te3. Interestingly, we predict atomic structures that are in much better agreement with the experimentally determined structure from Nakajima than that obtained from Wyckoff, especially for Bi2Se3 where the difference in atomic structures qualitatively changes the electronic band structure. The band structure obtained using the Nakajima structure, and the theoretically optimized structure, are in much better agreement with previous reports of photoemission measurements, than that obtained using the Wyckoff structure. Fully optimizing atomic structures of bulk and thin film Bi2Se3 and Bi2Te3 under different in-plane and uniaxial strains, we predict that the electronic band gap of both the bulk materials and thin films decreases with tensile in-plane strain and increases with compressive in-plane strain. We also predict, using the semiclassical Boltzmann approach, that the magnitude of the n-type Seebeck coefficient of Bi2Te3 can be increased by the compressive in-plane strain, while that of Bi2Se3 can be increased with tensile in-plane strain. Further, the in-plane power factor of n-doped Bi2Se3 can be increased with compressive uniaxial strain, while that of n-doped Bi2Te3 can be increased by compressive in-plane strain. ...
科研通智能强力驱动
Strongly Powered by AbleSci AI