Deepa Bhatt,Karen Williams,David A. Hutt,Paul Conway
标识
DOI：10.1109/cleo.2008.4552251
摘要
Excimer laser machining of microvias and tracks in CMZ glass (100 mum thick) at 248 nm has been investigated and optimised in order to minimise hole taper, microcracking and debris.
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(2025-6-4)
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