Study of ordered phase precipitation behaviour and hardening mechanism of Au-20Ag-10Cu alloy during deformation-aging treatment

材料科学 压痕硬度 合金 微观结构 电子背散射衍射 冶金 复合材料 沉淀硬化 透射电子显微镜 纳米技术
作者
Senxiang Yan,Aijuan Wang,Rong Liu,Xiaolong Ma,Qiang Meng,Ziyuan Zhao,Tong Zhao,You Chen
出处
期刊:Journal of Alloys and Compounds [Elsevier BV]
卷期号:976: 173007-173007
标识
DOI:10.1016/j.jallcom.2023.173007
摘要

With the rapid development of aerospace technology, the demand for a longer service life of Au-Ag-Cu alloy as conductive slip rings is increasing. Therefore, it is important to improve the hardness of the alloys in order to prolong their service life. Deformation-aging can improve the hardness of many alloys. The effect of the deformation-aging process of Au-20Ag-10Cu (wt%) alloy was investigated on the microstructure and properties, which characterized by DSC(Differential Scanning Calorimeter), XRD(X-ray Diffraction), EBSD(Electron Backscatter Diffraction), TEM(Transmission Electron Microscope) characterization techniques, microhardness and electrical conductivity testing methods. The results indicated that the microhardness increases and the conductivity decreases gradually with the increase of deformation rate. As the aging time increasing, the content of face-centered tetragonal AuCu I ordered phase increases, and thus the hardness increases gradually. The maximum hardness value of 307.44 HV was obtained after undergoing 70 % deformation and then aged at 300 ℃ for 16 h with the electrical conductivity values of 8.40 MS·m−1. This result indicated that both higher hardness and higher electrical conductivity of Au-20Ag-10Cu (wt%) alloy could be obtained, which ensures the requirements in the field of electrical contact materials.
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