Reducing Thermal Interface Resistance by Oxygen Plasma Treatment for FCBGA Advanced Package

With the miniaturization and functionalization of electronic equipment, the problem of chip heat dissipation has become a serious challenge. In this article, a plasma reaction technology is applied to improve the heat dissipation performance between the thermal interface material (TIM) and the heat spreader. Oxygen plasma can not only improve the surface wettability of the heat spreader, but also form a thin layer of nickel oxide on the heat spreader surface. Nickel oxide can act as a layer of phonon transfer bridge between heat spreader and TIM to enhance the phonon transfer at the interface. The as-obtained packaged module has a 42.50% decrease in thermal resistance compared to the original module. Moreover, molecular dynamics simulations were conducted to investigate the mechanism of nickel oxide layer promoting phonon interface conduction.