Dual wheel miniature gang for silicon wafer dicing

Shrinking line width geometries in IC-devices translate into a substantial increase in the number of chips per wafer. However, as a consequence, it also results in a greatly extended cut length during wafer dicing. Since the cutting speed is already quite high, no substantial increase of it may be expected. As a solution, the use of a dual gang wheel is suggested in this paper. Whereas conventional gang wheel dicing requires specially designed machines to support the gang wheel arbor, this new approach allows mounting of a dual dicing wheel on the same pair of flanges designed for single hubless dicing wheel use. Dicing tests showed that the dual gang wheel dicing approach is suitable for achieving the same feed rate as single wheel dicing, as well as obtaining a comparable kerf quality.