分子动力学
各向异性
材料科学
变形(气象学)
开裂
沟槽(工程)
粗糙度(岩土工程)
脆性
Crystal(编程语言)
变形机理
复合材料
刮伤
凝聚态物理
冶金
计算化学
光学
物理
化学
微观结构
计算机科学
程序设计语言
作者
Baozhen Li,Jianyong Li,Jinhuan Xu,Tong Xuan,Wengang Fan
标识
DOI:10.1016/j.triboint.2022.108200
摘要
As previous studies have neglected the effect of cracking on the deformation of hard and brittle materials during processing, our interest lies in assessing how cracking affects the deformation of GaAs with varied crystal orientations. This paper offers molecular dynamics simulations of a diamond indenter scratching on GaAs with a single asperity in several crystal orientations. This work gives direct evidence that cracking alters the deformation behavior of distinct crystal orientations at the atomic level. The results demonstrate that such discrepancies are caused by the distribution of tensile stresses and the fracture surface. This work offers new insights into understanding the deformation mechanism anisotropy of an asperity GaAs in various crystal orientations.
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