Non-covalent modification of boron nitride nanoparticle-reinforced PEEK composite: Thermally conductive, interfacial, and mechanical properties

A non-covalent modified boron nitride(n-CMBN) was obtained by non-covalent modification successfully and used to prepare poly(ether ether ketone)(PEEK) composites. The non-covalent modifier is polyetherimide(PEI), which has high compatibility with PEEK. Particularly, only a small amount of PEI was used to modify BN, which made the thermal conductivity of 30 wt% n-CMBN/PEEK reached 1.01 W·(m·K)−1, 16% higher than that of BN/PEEK. Modified Hashin-Shtrikman model demonstrated that n-CMBN/PEEK possessed 7% lower total thermal resistance compared with BN/PEEK. Moreover, the tensile strength and elongation at break remains above 99.0 MPa and 14.6% respectively, demonstrating the relatively good mechanical properties in high thermally conductive composites. The introduction of 10 wt% n-CMBN decrease the friction coefficient of PEEK composites, which was as low as 0.33 of 30% lower than that of PEEK. In addition, the 5% weight loss temperature were above 557 °C, exhibiting the excellent heat resistant.