电极
材料科学
表面微加工
电场
光刻胶
光电子学
蚀刻(微加工)
GSM演进的增强数据速率
机械加工
电火花加工
电化学加工
复合材料
纳米技术
干法蚀刻
电阻和电导
各向同性腐蚀
光刻
领域(数学)
平板电极
电极阵列
体微机械加工
雕刻
接触电阻
作者
Xiaochen Yang,Bingze Shang,Bingnan Liu,Pan Sun,Liqun Du,Jianfeng Cui
标识
DOI:10.1149/1945-7111/ae6534
摘要
Through-mask electrochemical micromachining (TMEMM) is a key technique for fabricating metal microstructures. However, manipulating the electric field to achieve various machining profiles remains a persistent challenge. To address this limitation, this paper introduces a sacrificial electrode into induction electrode TMEMM (IETMEMM) for the first time and proposes a novel method called sacrificial electrode-assisted IETMEMM (SE-IETMEMM). The sacrificial electrode is placed on the photoresist and is electrically connected to the workpiece through the regulating resistor. By adjusting the resistance, the potential of the sacrificial electrode is altered, enabling precise manipulation of the electric field distribution on the machined surface. Specifically, as the resistance increases, the electric field distribution evolves from center concentration to a uniform distribution and subsequently to edge concentration. This evolution is experimentally verified using the machining profiles of gear patterns. At a resistance of 0 Ω, the fabricated specimen exhibits a shallow edge and a deep center, indicating high localization with an etching factor ( EF ) of 10.3. At a resistance of 0.1 Ω, the profile becomes uniformly flat, with a non-uniformity ( Nu ) of only 12.2%. At a resistance of 1 Ω, the fabricated specimen exhibits an island-like profile. Compared with traditional TMEMM, SE-IETMEMM enhances localization by 836.4% at 0 Ω and improves uniformity by 78.1% at 0.1 Ω.
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