Electroless Deposition of Ni-Cu-P Alloys in Acidic Solutions

Inclusion of in electroless deposited amorphous alloys improves their thermal stability, brightness, and corrosion resistance. The mechanism of codeposition of a third element during the electroless deposition of is still not clear. A simple model for codeposition of is proposed. It claims the three different roles played by added to the solution for electroless nickel plating: as a stabilizer ; as an accelerator (due to the catalytic properties of alloys); and as affecting the solution stability (due to the formation of randomly dispersed copper particles in the solution). A comparison between copper content detected in the deposit and predicted on the basis of the model has been made. The model allowed production of amorphous coatings with increased copper content and consequently improved thermal (nonferromagnetic) stability. ©1999 The Electrochemical Society