电磁屏蔽
材料科学
单层
小型化
电磁干扰
电磁干扰
电磁辐射
光电子学
反射(计算机编程)
数码产品
吸收(声学)
纳米技术
光学
复合材料
电气工程
电信
计算机科学
程序设计语言
工程类
物理
作者
Taeyeong Yun,Hyerim Kim,Aamir Iqbal,Yong Soo Cho,Gang San Lee,Myung‐Ki Kim,Seon Joon Kim,Daesin Kim,Yury Gogotsi,Sang Ouk Kim,Chong Min Koo
标识
DOI:10.1002/adma.201906769
摘要
Abstract Miniaturization of electronics demands electromagnetic interference (EMI) shielding of nanoscale dimension. The authors report a systematic exploration of EMI shielding behavior of 2D Ti 3 C 2 T x MXene assembled films over a broad range of film thicknesses, monolayer by monolayer. Theoretical models are used to explain the shielding mechanism below skin depth, where multiple reflection becomes significant, along with the surface reflection and bulk absorption of electromagnetic radiation. While a monolayer assembled film offers ≈20% shielding of electromagnetic waves, a 24‐layer film of ≈55 nm thickness demonstrates 99% shielding (20 dB), revealing an extraordinarily large absolute shielding effectiveness (3.89 × 10 6 dB cm 2 g −1 ). This remarkable performance of nanometer‐thin solution processable MXene proposes a paradigm shift in shielding of lightweight, portable, and compact next‐generation electronic devices.
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