微系统
三维集成电路
一体化设计
互连
小型化
集成电路
计算机科学
集成电路设计
系统设计
电子工程
工程类
系统工程
嵌入式系统
电气工程
材料科学
纳米技术
计算机网络
土木工程
作者
Xianglong Wang,Dongdong Chen,Di Li,Chen Kou,Yintang Yang
出处
期刊:Symmetry
[MDPI AG]
日期:2023-02-04
卷期号:15 (2): 418-418
被引量:2
摘要
In order to meet the requirements of high performance, miniaturization, low cost, low power consumption and multi-function, three-dimensional (3D) integrated technology has gradually become a core technology. With the development of 3D integrated technology, it has been used in imaging sensors, optical integrated microsystems, inertial sensor microsystems, radio-frequency microsystems, biological microsystems and logic microsystems, etc. Through silicon via (TSV) is the core technology of a 3D integrated system, which can achieve vertical interconnection between stacked chips. In this paper, the development and progress of multi-physics simulation design for TSV-based 3D integrated systems are reviewed. Firstly, the electrical simulation design of TSV in a 3D integrated system is presented, including the lumped parameters model-based design and numerical computation model-based design. Secondly, the thermal simulation design of TSV in a 3D integrated system is presented based on the analytical model or numerical computation model. Thirdly, the multi-physics co-simulation design of TSV in a 3D integrated system is presented, including the thermal stress and electron thermal coupling simulation design. Finally, this paper is concluded, and the future perspectives of 3D integrated systems are presented, including the advanced integrated microsystems, the crossed and reconfigurable architecture design technology and the standardized and intelligent design technology.
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