Molecular Design of Amine-Based Surfactants for Improving Electrical Reliability of Copper-Filled Conductive Pastes

This paper examined the effect of triethanolamine (TEA) and related surfactants on the electrical conductivity and reliability of copper-filled electrically conductive pastes. The TEA surfactant effectively enhanced the electrical conductivity but not the electrical reliability in an 85°C/85%RH environment. When the TEA surfactant was used, the co-applying of oleic acid improved electrical reliability. The tris(2-amino ethyl)amine (TREN), which has a molecular structure with amino groups by substituting TEA hydroxyl groups, enhanced electrical conductivity and reliability. Because the surfactants can sensitively control the electrical conductivity and reliability, the molecular design will be critical in developing advanced Cu-filled pastes.