The electron mobility degradation for HfSiON MISFETs was investigated. We found that the degradation had two origins; one is Coulomb scattering caused by fixed charges in HfSiON films and the other is phonon scattering by interfacial thin oxynitrided (SiON) layer; and HfSiO-related remote phonon scattering is not dominant. The mobility degradation caused by the Coulomb scattering and SiON phonon scattering is separated into two components and we develop an empirical mobility model for HfSiON devices that enables accurate simulation of electrical characteristics of the HfSiON devices