材料科学
液态金属
焊接
数码产品
互连
复合材料
柔性电子器件
电接点
可伸缩电子设备
导电体
弯曲半径
弯曲
光电子学
计算机科学
电气工程
工程类
计算机网络
作者
Menglu Li,Yongzhi Wu,Liang Zhang,Hualei Wo,Shuyi Huang,Wei Li,Xiangyu Zeng,Qikai Ye,Tianbai Xu,Jikui Luo,Shurong Dong,Yubo Li,Hao Jin,Xiaozhi Wang
出处
期刊:Nanoscale
[Royal Society of Chemistry]
日期:2019-01-01
卷期号:11 (12): 5441-5449
被引量:55
摘要
We report on the detailed investigations on the reliability and stability of the liquid metal-based interconnects/interfaces under various mechanical deformations and compare them with those using silver paste. The results demonstrate that liquid metal interconnects and interfaces show superior performance than those of silver paste ones.
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