Delamination modeling in LED package by cohesive zone method

Reliability problem is becoming a bottleneck of LED application in different fields. Delamination is one of them in light emitting diode during operation. In order to better understand the process of delamination the three-dimensional finite element method with cohesive zone elements was established to know it. The maximum Von Mises stress was found at the interface between die and die attach. The influence of ambient temperature on the level of delamination was investigated with sub-model technique. Meanwhile the cohesive zone method has a good prediction of interface delamination.