Heat Resistance and Electrophysical Characteristics of Polyheteroarylenes and Ferroelectric–Polymer Film Composites Based on Them

Structurally related poly(amido-o-hydroxy amides) derived from 5,5-methylenebis(2-aminophenol) with tetramethylsiloxane and heteroaromatic (benzoxazole and benzotriazole) fragments incorporated in the second amine component or formed by polyheterocyclization of the corresponding prepolymers were prepared. The effect of modifying fragments introduced into the base poly(o-hydroxy amide) on the heat resistance of powders and films and of films of photosensitive compounds based on the synthesized polymers with the naphthoquinone diazide component was analyzed. The electrophysical parameters of the polymer films and film composites with a nanodispersed ferroelectric filler, (PZT: ceramic powder with the composition Pb0.81Sr0.04Na0.075Bi0.075(Zr0.58 Ti0.42)O3, Russian brand PZT-1), prepared on the basis of modified polymer binders, were determined. Introduction of 20 mol % sulfur-containing fragments into the polymer binder ensures a 50–65˚C increase in the heat resistance for all types of films without increasing the level of the dielectric loss for the composite coatings.